Patent · US Active

Sub-assembly

US7450389B2 · kind B2 · utility

4Cited by

8References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thilo Stolze · Arnsberg, DE
Richard Boettcher · Warstein, DE

Key dates

Filing date	Mar 6, 2007
Grant date	Nov 11, 2008
Priority date	—
Expiry date	Mar 6, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module has a heat-dissipation contact surface (16) for a thermally conductive connection to a cooling element (17). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to the latter by at least one pressure element (18, 19) which is permanently connected to the power semiconductor module. When mounted, the pressure element (18) presses the heat-dissipation contact surface (16) against the cooling element (17).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.