Process for manufacturing a microfluidic device with buried channels
US7452713B2 · kind B2 · utility
24Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2005 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Oct 13, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/1827
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A process for manufacturing a microfluidic device, including the steps of: forming at least one channel in a semiconductor material body; forming a dielectric diaphragm above the channel, for closing the channel; and forming heating elements for providing thermal energy inside the channel. The heating elements are formed directly on said dielectric diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.