Patterning process and resist overcoat material
US7455952B2 · kind B2 · utility
44Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Apr 28, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2041
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In an immersion lithography process, a pattern is formed by forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from a resist overcoat material, exposing the layer structure to light in water, and developing. A water-insoluble, alkali-soluble material is used as the resist overcoat material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.