Packaging method for segregating die paddles of a leadframe
US7456053B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2006 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jun 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging method for segregating die paddles of a leadframe, includes (a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality of die paddles, wherein at least two of the die paddles are connected to each other by at least one connecting bar; (b) attaching a plurality of dies onto the die paddles; (c) forming a molding compound to encapsulate the dies on the die paddles, and exposing the bottom surface of the connecting bar outside the molding compound; and (d) removing part of the connecting bar so as to segregate the die paddles. The die paddles are thus rendered stable during the steps of die attaching, wire bonding and molding, and the yield is raised.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.