Semiconductor device and method of manufacturing the semiconductor device
US7456089B2 · kind B2 · utility
44Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2006 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jul 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a second end, opposite to the first end, projecting from the encapsulation resin, and an external connection member is connected to the column electrode at the second end so that the external connection member is separate from a surface of the encapsulation resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.