Sealing porous dielectrics with silane coupling reagents
US7456490B2 · kind B2 · utility
6Cited by
10References
7Claims
0Family size
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Key dates
| Filing date | Sep 5, 2006 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Dec 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure for sealing porous dielectrics using silane coupling reagents is herein described. A sealant chain (silane coupling reagent) is formed from at least silicon, carbon, oxygen, and hydrogen and exposed to a porous dielectric material, wherein the sealant chain reacts with a second chain, that has at least oxygen and is present in the porous dielectric defining the pores, to form a continuous layer over the surface of the porous dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.