Bulk acoustic resonator including a resonance part with dimple and fabrication method therefor
US7456709B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2006 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Feb 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/023
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A bulk acoustic resonance and a method for fabricating the bulk acoustic resonator, the bulk acoustic resonator including: a substrate including an upper surface defining a predetermined area including a cavity; a resonance part positioned above the cavity and including a surface comprising a dimple; and an anchor part connecting the resonance part to the substrate. The resonance part includes: a lower electrode including a lower surface including a predetermined dimpled area and an upper surface opposite to the predetermined dimpled area; a piezoelectric layer stacked on the upper surface of the lower electrode; and an upper electrode stacked on the piezoelectric layer. Because direction of the vibration of the resonator is adjustable by adjusting position, area, and the number of the dimples, process freedom can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.