Woon-bae Kim
84Patents
12h-index
85Co-inventors
87Inventor score
Filing activity: Feb 1, 1993 → Dec 7, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7285865B2 | Micro-package, multi-stack micro-package, and manufacturing method therefor | Electricity | 50 | Expired |
| US7794799B1 | Process for producing array plate for biomolecules having hydrophilic and hydrophobic regions | Chemistry; Metallurgy | 37 | Expired |
| US7580195B2 | Optical lens and method of manufacturing the same | Physics | 27 | Active |
| US7923793B2 | Image sensor module and fabrication method thereof | Electricity | 22 | Active |
| US7589422B2 | Micro-element package having a dual-thickness substrate and manufacturing method thereof | Electricity | 19 | Active |
| US6633513B1 | Magneto-optical head for magneto-optical reading and writing system | Physics | 17 | Expired |
| US7065867B2 | Low temperature hermetic sealing method having passivation layer | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7719167B2 | Electroactive polymer actuator and manufacturing method thereof | Emerging Cross-Sectional Technologies | 14 | Active |
| US7408434B2 | Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package | Emerging Cross-Sectional Technologies | 13 | Active |
| US8149512B2 | Micro-shutter device and method of manufacturing the same | Physics | 13 | Active |
| US6969639B2 | Wafer level hermetic sealing method | Electricity | 12 | Expired |
| US7667946B2 | Tunable capacitor using electrowetting phenomenon | Electricity | 12 | Active |
| US7008817B2 | Method for manufacturing micro electro-mechanical systems using solder balls | Electricity | 12 | Expired |
| US7417525B2 | High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor | Electricity | 11 | Active |
| US7408257B2 | Packaging chip and packaging method thereof | Electricity | 10 | Active |
| US7786573B2 | Packaging chip having interconnection electrodes directly connected to plural wafers | Electricity | 10 | Active |
| US7374972B2 | Micro-package, multi-stack micro-package, and manufacturing method therefor | Electricity | 9 | Active |
| US7986466B2 | Varifocal lens | Physics | 9 | Active |
| US7755151B2 | Wafer level package for surface acoustic wave device and fabrication method thereof | Electricity | 9 | Active |
| US7663083B2 | Image sensor module having electric component and fabrication method thereof | Electricity | 9 | Active |
| US6906845B2 | Micro-mechanical device having anti-stiction layer and method of manufacturing the device | Performing Operations; Transporting | 9 | Expired |
| US5754360A | Magnetic recording/reproducing apparatus | Physics | 7 | Expired |
| US7545017B2 | Wafer level package for surface acoustic wave device and fabrication method thereof | Electricity | 6 | Active |
| US8531580B2 | Imaging device including a plurality of imaging units | Electricity | 5 | Active |
| US7335974B2 | Multi stack packaging chip and method of manufacturing the same | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.