Grinding apparatus and method
US7458878B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2006 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Oct 10, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.