Salman Kassir
10Patents
7h-index
3Co-inventors
51Inventor score
Filing activity: Nov 17, 1997 → Oct 10, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5964646A | Grinding process and apparatus for planarizing sawed wafers | Performing Operations; Transporting | 47 | Expired |
| US6254155A | Apparatus and method for reliably releasing wet, thin wafers | Electricity | 20 | Expired |
| US7118446B2 | Grinding apparatus and method | Performing Operations; Transporting | 15 | Expired |
| US6638389B2 | Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6743722B2 | Method of spin etching wafers with an alkali solution | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7160808B2 | Chuck for supporting wafers with a fluid | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7018268B2 | Protection of work piece during surface processing | Performing Operations; Transporting | 8 | Expired |
| US7458878B2 | Grinding apparatus and method | Performing Operations; Transporting | 7 | Active |
| US7059942B2 | Method of backgrinding wafers while leaving backgrinding tape on a chuck | Electricity | 6 | Expired |
| US6866564B2 | Method of backgrinding wafers while leaving backgrinding tape on a chuck | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.