Dissociated fabrication of packages and chips of integrated circuits
US7459376B2 · kind B2 · utility
0Cited by
15References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2005 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | May 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a semiconductor component includes providing a prefabricated frame that includes metal traces and lead-through contacts. A semiconductor chip is mounted into the prefabricated frame such that the semiconductor chip is embedded within a rim of the prefabricated frame. Contact regions on a surface of the semiconductor chip are electrically connected with the metal traces of the prefabricated frame such that the contact regions are electrically coupled to the lead-through contacts via the metal traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.