Device containing isolation regions with threading dislocations
US7459731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2006 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Jan 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An article of manufacture includes a substrate, a relaxed buffer layer disposed on the substrate, and a plurality of isolation regions formed in the relaxed buffer layer. The isolation regions include threading dislocations while the remainder of the relaxed buffer layer is substantially free of threading dislocations. The relaxed buffer layer may be formed from silicon germanium while the substrate may be formed from silicon. A capping layer may be disposed over the relaxed buffer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.