Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
US7460367B2 · kind B2 · utility
38Cited by
21References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2007 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Apr 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.