Patent · US Active

Adhesive system for supporting thin silicon wafer

US7462551B2 · kind B2 · utility

11Cited by

2References

5Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sudhakar N. Kulkarni · Chandler, US
Leonel Arana · Phoenix, US
Edward R. Prack · Phoenix, US

Key dates

Filing date	Sep 30, 2005
Grant date	Dec 9, 2008
Priority date	—
Expiry date	Oct 8, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68381
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In some embodiments, an adhesive system for supporting thin silicon wafer is presented. In this regard, a method is introduced to bond a silicon wafer to a translucent carrier through the use of an adhesive. Other embodiments are also disclosed and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.