Microelectromechanical component and method for the production thereof
US7462919B2 · kind B2 · utility
11Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2004 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | May 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.