Formation of circuitry with modification of feature height
US7462936B2 · kind B2 · utility
80Cited by
57References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2004 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Feb 11, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.