Die pillar structures and a method of their formation
US7462942B2 · kind B2 · utility
136Cited by
7References
59Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2003 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Oct 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.