System and method for controlling temperature during burn-in
US7463050B1 · kind B1 · utility
1Cited by
37References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2005 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | May 26, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for reducing temperature dissipation during burn-in testing are described. Devices under test are each subject to a body bias voltage. The body bias voltage can be used to control junction temperature (e.g., temperature measured at the device under test). The body bias voltage applied to each device under test can be adjusted device-by-device to achieve essentially the same junction temperature at each device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.