Compact via transmission line for printed circuit board and its designing method
US7463122B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Apr 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.