Method and apparatus for forming a low profile wire loop
US7464854B2 · kind B2 · utility
7Cited by
9References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 6, 2006 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Feb 27, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12507
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming a looped portion in the wire adjacent the first wire bond. The method also includes lowering the wire bonding tool in a direction towards the first wire bond after the forming step. The lowering step is interrupted prior to the wire bonding tool contacting the first wire bond. The method also includes bonding a second end of the wire to a second bonding location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.