High aspect ratio microelectrode arrays
US7465661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2003 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Sep 29, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of electroplating a metal into a plurality of channels within an insulating material includes mounting the material to a cathode; placing the cathode into an electroplating solution containing the metal; placing an anode into the electroplating solution; connecting the cathode and the anode to a power supply; controlling operation of the power supply to provide a beginning current density during deposition at the insulating material and initiating electroplating of the metal within the plurality of channels starting at one face of the insulating material; and controlling operation of the power supply to provide a final current density during deposition at the insulating material and ending electroplating of the metal within the plurality of channels at the other face of the insulating material. The final current density is larger than the beginning current density, and the beginning current density is maintained at a level for a sufficient time to substantially prevent bubble formation during the electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.