Ceramic substrate grid structure for the creation of virtual coax arrangement
US7465882B2 · kind B2 · utility
7Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2006 |
| Grant date | Dec 16, 2008 |
| Priority date | — |
| Expiry date | Dec 13, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.