Semiconductor wafer treatment method
US7468309B2 · kind B2 · utility
112Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2006 |
| Grant date | Dec 23, 2008 |
| Priority date | — |
| Expiry date | Jun 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/743
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer treatment method for dividing an adhesive tape, which has been stuck to the entire back of a semiconductor wafer, along divided streets of the semiconductor wafer. Before division of the adhesive tape by application of laser beams, the state of the divided streets is detected, and laser beams are applied to the adhesive tape based on such detection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.