Multi-conducting through hole structure
US7470864B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2005 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Nov 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09645
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a through hole passing therethrough. The signal lines are disposed on a portion of an inner surface of the through hole and extended through the through hole. The reference line is disposed on a portion of the inner surface of the through hole and extended through the through hole, wherein the reference line is disposed between the lines for signal. Because the signal lines are separated by the reference line, the electromagnetic coupling generated by signals can be reduced to lower the cross-talk interference between signals passing through the through hole, so as to promote the signal-transmission quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.