Multi-substrate package assembly
US7470894B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2006 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Feb 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F30/223
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.