Packaging method
US7470996B2 · kind B2 · utility
26Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2006 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Jul 31, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.