Ryuichiro Abe
8Patents
2h-index
16Co-inventors
44Inventor score
Filing activity: Dec 6, 2005 → Apr 17, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7470996B2 | Packaging method | Electricity | 26 | Active |
| US7327004B2 | Sensor device | Electricity | 10 | Expired |
| US7670918B2 | Semiconductor device having impurity-doped resistor element | Electricity | 1 | Active |
| US7615832B2 | Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip | Electricity | 1 | Active |
| US7541574B2 | Sensor device | Physics | 1 | Active |
| US7373821B2 | Semiconductor sensor and manufacturing method therefor | Emerging Cross-Sectional Technologies | 1 | Active |
| US7770452B2 | Semiconductor sensor and manufacturing method therefor | Emerging Cross-Sectional Technologies | 0 | Active |
| US10901049B2 | Magnetic sensor and method for manufacturing said magnetic sensor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.