High density data storage medium
US7471614B2 · kind B2 · utility
13Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2003 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | May 6, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C13/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method reading, writing, and erasing data includes bringing a thermal-mechanical probe into proximity with a layer of cross-linked polymeric material to induce a deformed region at a point in the film, thereby writing information; bringing a thermal-mechanical probe into proximity with the deformed region, thereby reading information; and bringing a thermal-mechanical probe into proximity with the deformed region, further deforming it in such a way to eliminate the deformed region, thereby erasing the information; and repeating the storing, reading, and erasing steps at points in the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.