Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
US7472477B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Nov 2, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly attach to surface connections on a printed circuit board. An elongated housing is formed comprising at least two members that are coupled together and disposed to form an aperture in between the at least two members. At least one dimension of the at least two members is selected to compensate for a difference between coefficients of thermal expansion between the socket and the printed circuit board. The at least two members and the surface mounted contacts are aligned with the printed circuit board using a clip. In response to completing a solder reflow process, the clip is removed and a module is inserted into the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.