Space transforming land grid array interposers

US7473102B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Evan G. Colgan · Chestnut Ridge, US
• Paul W. Coteus · Yorktown Heights, US
• Hubert Harrer · Böblingen, DE
• Gareth G. Hougham · Ossining, US
• John Harold Magerlein · Yorktown Heights, US
• John G. Torok · Poughkeepsie, US

Key dates

• Filing date: Mar 31, 2006
• Grant date: Jan 6, 2009
• Expiry date: Mar 31, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10719
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic apparatus includes first and second level package structures and an LGA (land grid array) interposer. The first level package structure includes a package substrate, one or more integrated circuit chips mounted on a first surface of the package substrate, and a first pattern of I/O contacts with pitch P1 formed on a second surface of the package substrate opposite the first surface. The second level package structure includes a second pattern of I/O contacts with pitch P2, wherein P2 is not equal to P1. The LGA interposer is disposed between the first and second level package structures and provides space transform electrical interconnections between the first second patterns of I/O contacts, and further includes a dummy contact formed on at least a first or second surface of the LGA interposer and aligned to an LGA contact on an opposing surface of the LGA interposer.