Film stack having under layer for preventing pinhole defects
US7473461B2 · kind B2 · utility
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2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2007 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jul 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film stack is provided in which a first film including a first polymer directly contacts a surface of a substrate at which a given material is exposed. A second film, which can include a second polymer other than the first polymer, is formed to have an inner surface contacting the first film. The second film can have a thickness at which a free energy of the second film would be negative if the second film were disposed directly on the substrate. Desirably, the resulting second film is substantially free of dewetting defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.