Soldering method, component to be joined by the soldering method, and joining structure
US7473476B2 · kind B2 · utility
3Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2004 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Feb 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12882
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.