Laser processing apparatus
US7473866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2006 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jul 9, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.