Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7473995B2 · kind B2 · utility
30Cited by
34References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2002 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Mar 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.