Circuit board embedded inductor
US7474189B1 · kind B1 · utility
3Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2005 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.