Methods and apparatus for enhancing electronic device manufacturing throughput
US7474934B2 · kind B2 · utility
3Cited by
10References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2005 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Jul 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and apparatus are provided that include determining a number of storage locations corresponding to busy chambers of an electronic device manufacturing tool; based on the number of storage locations corresponding to busy chambers, determining whether the electronic device manufacturing tool may accommodate a substrate; and of the electronic device manufacturing tool may accommodate a substrate, receiving a substrate in the electronic device manufacturing tool. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.