Solder ball loading method and solder ball loading unit background of the invention
US7475803B2 · kind B2 · utility
7Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53209
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the loading cylinder 24 in a horizontal direction and the solder balls 78s are dropped onto the electrodes 75 on a multilayer printed wiring board 10 through an openings 16a in the ball arranging mask 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.