Method and apparatus for electroplating
US7476306B2 · kind B2 · utility
6Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jul 27, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and method for metal electroplating. The apparatus for metal electroplating includes an electroplating tank for containing an electrolyte at a first temperature, a substrate holder for holding a semiconductor substrate, and a heater for heating the portion of the electrolyte adjacent to the substrate holder to a second temperature higher than the first temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.