Flip-chip packaging process using copper pillar as bump structure
US7476564B2 · kind B2 · utility
40Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2005 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jan 28, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip packaging process is disclosed. The present invention is featured in forming a copper pillar on a wafer, forming a solder on a substrate; and enabling the solder to substantially cover the entire externally-exposed surface of the copper pillar, thereby connecting the copper pillar to the substrate. The copper pillar of the present invention can be such as a prism or a cylinder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.