Wafer-level assembly of heat spreaders for dual IHS packages
US7476568B2 · kind B2 · utility
4Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Nov 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention is a technique to fabricate a package. A heat spreader (HS) array on a HS support substrate is formed. The HS array has a plurality of heat spreaders. A diced wafer supported by a wafer support substrate (WSS) is formed. The diced wafer has a plurality of thin dice. The thin dice in the diced wafer are bonded to the heat spreaders in the HS array to form HS-bonded thin dice between the HS support substrate and the WSS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.