Rajashree Baskaran
40Patents
5h-index
47Co-inventors
65Inventor score
Filing activity: Sep 24, 2004 → Jul 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10462578B2 | Piezoelectric contact microphone with mechanical interface | Electricity | 31 | Active |
| US7517228B2 | Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit | Electricity | 9 | Active |
| US8541876B2 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Electricity | 7 | Active |
| US9196752B2 | Backside bulk silicon MEMS | Electricity | 6 | Active |
| US7557438B2 | Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same | Electricity | 5 | Active |
| US9294035B2 | Multigate resonant channel transistor | Electricity | 5 | Active |
| US9503829B2 | Ear pressure sensors integrated with speakers for smart sound level exposure | Electricity | 5 | Active |
| US10455324B2 | Apparatus and methods for bone conduction context detection | Electricity | 5 | Active |
| US9400557B2 | Multimodal haptic effect system | Physics | 5 | Active |
| US7723759B2 | Stacked wafer or die packaging with enhanced thermal and device performance | Electricity | 5 | Active |
| US7476568B2 | Wafer-level assembly of heat spreaders for dual IHS packages | Electricity | 4 | Active |
| US9720496B2 | Techniques for stabilizing a display scene output | Physics | 4 | Active |
| US7449361B2 | Semiconductor substrate with islands of diamond and resulting devices | Electricity | 3 | Active |
| US7833816B2 | Forming a thin film thermoelectric cooler and structures formed thereby | Emerging Cross-Sectional Technologies | 3 | Active |
| US9508675B2 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Electricity | 2 | Active |
| US7902617B2 | Forming a thin film electric cooler and structures formed thereby | Emerging Cross-Sectional Technologies | 2 | Active |
| US11320883B2 | Multi-die stacks with power management | Emerging Cross-Sectional Technologies | 2 | Active |
| US7666714B2 | Assembly of thin die coreless package | Electricity | 2 | Active |
| US10827261B2 | Apparatus and methods for bone conduction context detection | Electricity | 2 | Active |
| US7371630B2 | Patterned backside stress engineering for transistor performance optimization | Electricity | 1 | Expired |
| US7875934B2 | Semiconductor substrate with islands of diamond and resulting devices | Electricity | 1 | Active |
| US11356772B2 | Apparatus and methods for bone conduction context detection | Electricity | 1 | Active |
| US9646972B2 | Methods of forming buried vertical capacitors and structures formed thereby | Electricity | 1 | Active |
| US9731369B2 | Interconnect alloy material and methods | Performing Operations; Transporting | 1 | Active |
| US11422551B2 | Technologies for providing a cognitive capacity test for autonomous driving | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.