Printed circuit board and manufacturing method thereof
US7476812B2 · kind B2 · utility
2Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Feb 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1184
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.