Masatoshi Inaba
9Patents
4h-index
14Co-inventors
54Inventor score
Filing activity: May 24, 2001 → Mar 20, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6387734B1 | Semiconductor package, semiconductor device, electronic device and production method for semiconductor package | Electricity | 51 | Expired |
| US6835595B1 | Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package | Electricity | 37 | Expired |
| US7023088B2 | Semiconductor package, semiconductor device and electronic device | Electricity | 36 | Expired |
| US7157363B2 | Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion | Electricity | 24 | Expired |
| US7476812B2 | Printed circuit board and manufacturing method thereof | Electricity | 2 | Active |
| US11638351B2 | Component-embedded substrate | Electricity | 1 | Active |
| US9006579B2 | Method of manufacturing printed circuit board and printed circuit board | Electricity | 1 | Active |
| US8282841B2 | Printed circuit board and manufacturing method thereof | Electricity | 0 | Active |
| US11979986B2 | Component-embedded substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.