Patent · US Expired

Photodiode array and method for establishing a link between a first semiconductor element and a second semiconductor element

US7476906B2 · kind B2 · utility

3Cited by

6References

14Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Robert Furst · Freising, DE
Mathias Kämpf · Burglengenfeld, DE
Melanie Ring · Birkenfeld, DE
Frank Singer · Regenstauf, DE

Key dates

Filing date	Jan 9, 2002
Grant date	Jan 13, 2009
Priority date	—
Expiry date	Jun 24, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/18
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to a photodiode array comprising a photodiode and a submount, via which the photodiode is contacted, said photodiode and said submount being interlinked by eutectic bonding. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. The two interlinked wafers are subdivided one by one and independently of each other in accordance with the desired outer contour.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.