Inventor · Burglengenfeld, DE

Mathias Kämpf

11Patents

2h-index

30Co-inventors

50Inventor score

Filing activity: Jan 9, 2002 → Jun 6, 2017

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9704945B2	Carrier substrate and method for producing semiconductor chips	Electricity	5	Active
US7476906B2	Photodiode array and method for establishing a link between a first semiconductor element and a second semiconductor element	Electricity	3	Expired
US7223952B2	Optical sensing head and method for fabricating the sensing head	Physics	2	Expired
US6693312B2	Method for fabricating an optical transmitting subassembly	Physics	2	Expired
US8916403B2	Method for producing a plurality of optoelectronic semiconductor chips	Electricity	2	Active
US9324615B2	Method for producing a semiconductor body	Electricity	1	Active
US10224393B2	Method of producing semiconductor chips that efficiently dissipate heat	Electricity	1	Active
US9303178B2	Suspensions for protecting semiconductor materials and methods for producing semiconductor bodies	Electricity	0	Active
US9768344B2	Method of producing a semiconductor body	Electricity	0	Active
US9450376B2	Method of producing a semiconductor laser element, and semiconductor laser element	Electricity	0	Active
US9663699B2	Suspensions for protecting semiconductor materials and methods of producing semiconductor bodies	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.