Electronic module with layer of adhesive and process for producing it
US7476981B2 · kind B2 · utility
11Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jul 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/81
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electronic module having a layer of adhesive between metallic surfaces of components of the module. The metallic surfaces are arranged facing one another. The adhesive of the layer of adhesive includes agglomerates of nanoparticles, which form paths, surrounded by an adhesive base composition, in the adhesive base composition. Furthermore, the invention relates to a process for producing the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.