Patent · US Active

Sub-assembly

US7477518B2 · kind B2 · utility

6Cited by

5References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thilo Stolze · Arnsberg, DE
Richard Boettcher · Warstein, DE

Key dates

Filing date	Feb 19, 2008
Grant date	Jan 13, 2009
Priority date	—
Expiry date	Feb 19, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to an embodiment, a power semiconductor module comprises a heat-dissipation contact area configured to thermally connect the power semiconductor module to a cooling element. The power semiconductor module also comprises a housing and a press-on element. The press-on element comprises an anchoring region and is captively anchored in the housing. A fixing eye is resiliently coupled with the anchoring region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.