Methods and apparatus for enhancing electronic device manufacturing throughput
US7477956B2 · kind B2 · utility
20Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2005 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Oct 2, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06Q10/06
- WIPO fieldIT methods for management
- WIPO sectorElectrical engineering
Abstract
In some aspects, a method is provided for enhancing electronic device manufacturing throughput within an electronic device manufacturing tool. The method includes the steps of (1) for the electronic device manufacturing tool, creating an electronic device manufacturing schedule based on process factors and mechanical factors associated with the manufacturing tool; and (2) employing the electronic device manufacturing schedule during electronic device manufacturing within the electronic device manufacturing tool. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.