Testing DRAM chips with a PC motherboard attached to a chip handler by a solder-side adaptor board with an advanced-memory buffer (AMB)
US7478290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2006 |
| Grant date | Jan 13, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5602
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Memory chips are tested by insertion into a chip test socket on a test adapter board that is mounted to the reverse or solder-side of a personal computer motherboard. A memory module socket is removed from the motherboard, and adapter pins are inserted into holes for the removed memory module socket, but from the reverse (solder) side of the motherboard. The adapter pins connect to the test adapter board either directly, through a connector plug, or through an intervening adapter board. The test adapter board has soldered onto it additional memory chips and buffer chips on a memory module, such as an Advanced Memory Buffer (AMB) for a fully-buffered memory module. The built-in-self-test (BIST) feature of the AMB may be used to test the memory chip under test in the chip test socket, or the processor on the motherboard may write and read the memory chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.