Integrated circuit package with sputtered heat sink for improved thermal performance
US7479703B1 · kind B1 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2007 |
| Grant date | Jan 20, 2009 |
| Priority date | — |
| Expiry date | Jul 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes an integrated circuit die having a circuit surface and a back surface opposite the circuit surface. A layer of ductile material is deposited on the back surface of the integrated circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.